Method for making noble metal conductive leads for suspension assemblies

ABSTRACT

A method of manufacturing an integrated lead head suspension flexure of the type having conductors on a spring metal layer capable of being etched by a first etching process. The method includes forming a patterned layer having gaps one or more flying lead regions of dielectric material on a major surface of the spring metal layer and forming one or more conductive leads on the flexure, including onto the dielectric material and over exposed spring metal at the gap at each flying lead region. At least the flying lead portion of the conductive lead is formed from conductive material resistant to the first etching process. The method also includes etching a flying lead region of the spring metal layer to remove a portion of the spring metal layer in the flying lead region and expose the flying lead portions of the conductive lead.

REFERENCE TO RELATED APPLICATION

This application is a division of U.S. patent application Ser. No.11/129,190, filed May 13, 2005, and entitled Method for Making NobleMetal Conductive Leads for Suspension Assemblies, which claims thebenefit of U.S. Provisional Application No. 60/571,476, filed May 14,2004 and entitled Additive Process for Manufacturing Suspensions withNoble Metal Conductors, both of which are hereby incorporated byreference in their entirety.

FIELD OF THE INVENTION

The invention relates generally to magnetic disk drive head suspensions.In particular, the invention is a flexure with noble metal conductorsand an additive process for manufacturing the flexure.

BACKGROUND OF THE INVENTION

Additive processes for manufacturing conductive traces on suspensioncomponents are known in the art. U.S. Pat. No. 5,666,717 issued toMatsumoto, et al. discloses an additive process for manufacturingsuspensions with copper traces. U.S. Pat. No. 6,399,899 issued toOhkawa, et al. discloses an additive process with backside access totraces. Each of these patents disclose traces made of materials that aresusceptible to corrosion. In addition, the manufacturing methods taughtby these references require a large number of steps leading to a processthat is inefficient and requires extensive handling, making thesuspension components susceptible to damage and resulting in low yieldrates.

Thus, there remains, a continuing need for a process that is efficient,cost effective, and results in a suspension with corrosion resistantconductors. In addition, a need remains for high quality conductivetraces that are resistant to corrosion and are resistant to damage thatmay result from handling or rework.

SUMMARY OF THE INVENTION

The invention is directed toward an additive process of manufacturing anintegrated lead head suspension flexure of the type adapted to accept amagnetic head and having conductors on a spring metal layer. A layer ofdielectric material is applied to a portion of the spring metal layerand one or more conductors are formed onto the flexure, including acrossa gap in the dielectric material in a flying lead region. The conductorscan be formed by plating conductive material onto the flexure. Theconductors can include a flying lead portion and a primary portion. Theflying lead portion can be formed of the same material and at the sametime as the primary lead portion. Alternatively, the flying lead portioncan be formed in a separate process and be formed of differentmaterials. The spring metal layer is capable of being etched in theflying lead region of the flexure. At least the portion of theconductive leads formed in the flying lead region are resistant to theetching process so that the flying lead portions of the conductive leadsremain and are exposed by the etching process. Portions of theconductive leads may be covered with a cover layer of dielectricmaterial, which may be applied prior to the etching process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustration of a disk drive head suspension assemblyhaving a flexure with noble metal conductive leads in accordance withone embodiment of the present invention.

FIG. 2 is an illustration of the flexure shown in FIG. 1.

FIG. 3 is a detailed schematic representation of the flexure shown inFIG. 2.

FIG. 4 is a detailed cross-sectional view side view of a portion of theflexure shown in FIG. 3, showing a flying lead region and test padportion of one of the conductive leads.

FIG. 5 is a schematic representation of another embodiment of a flexurein accordance with the invention.

FIG. 6 is a detailed cross-sectional view of a portion of the flexureshown in FIG. 5 showing a multi-layered flying lead region and test padportion of one of the conductive leads.

FIG. 7 is a schematic representation of another embodiment of a flexurein accordance with the invention.

FIG. 8 is a detailed cross-sectional view of a portion of the flexureshown in FIG. 7, showing a multi-layered flying lead region and test padportion of one of the conductive leads.

FIG. 9 is a side view of the intersection of a portion of a primaryconductor portion and a flying lead region of the flexure shown in FIG.7.

FIG. 10 is a cross-sectional view of the intersection of a portion of aconductive lead of the flexure shown in FIG. 7 taken across the flyinglead region.

FIG. 11 is a schematic representation of still another embodiment of aflexure in accordance with the invention.

FIG. 12 is a detailed cross-sectional view of a portion of the flexureshown in FIG. 11, showing a conductive lead having a multi-layeredflying lead region, access feature, and primary conductor portions.

FIG. 13 is a cross-sectional side view of a portion of a flexureaccording to still another embodiment of the invention having a groundplane positioned beneath a portion of the conductive leads.

FIG. 14 is a detailed cross-sectional view of a portion of a flexureaccording to another embodiment of the invention showing a conductivelead grounded to a spring metal layer.

FIGS. 15A-C are cross-sectional side views of an alternative embodimentof the flexure shown in FIGS. 3 and 4 having a flying lead region withan attached reinforcement member.

FIGS. 16A-C are cross-sectional side views of another alternativeembodiment of the flexure shown in FIGS. 3 and 4 having a flying leadregion with an alternative reinforcement member.

FIGS. 17A-C are cross-sectional side views of still another alternativeembodiment of the flexure shown in FIGS. 3 and 4 having a flying leadregion with an alternative reinforcement member.

FIGS. 18A and B are cross-sectional side views of still anotheralternative embodiment of the flexure shown in FIGS. 3 and 4 having aflying lead region with an alternative reinforcement member.

FIGS. 19A and B are cross-sectional side views of still anotheralternative embodiment of the flexure shown in FIGS. 3 and 4 having aflying lead region with an alternative reinforcement member.

FIG. 19C is a top view of the flying lead region of the flexure shown inFIG. 19A.

FIG. 20 is a flow chart outlining the steps of an additive process ofmanufacturing conductive leads onto the flexure shown in FIGS. 3 and 4in accordance with one embodiment of the invention.

FIGS. 21A-L are side views of a flexure structure, illustrating thestructure at sequential steps of the manufacturing process according tothe flow chart of FIG. 20.

FIG. 22 is a flow chart outlining the steps of manufacturing conductiveleads onto the flexure shown in FIGS. 5 and 6 in accordance with anotherembodiment of the invention.

FIGS. 23A-K are side views of a flexure structure, illustrating thestructure at sequential steps of the manufacturing process according tothe flow chart of FIG. 22.

FIG. 24 is a flow chart outlining the steps of manufacturing conductiveleads onto the flexure shown in FIGS. 5 and 6 in accordance with anotherembodiment of the invention.

FIGS. 25A-K are side views of a flexure structure, illustrating thestructure at sequential steps of the manufacturing process according tothe flow chart of FIG. 24.

FIG. 26 is a flow chart outlining the steps of manufacturing conductiveleads onto the flexure shown in FIGS. 5 and 6 in accordance with anotherembodiment of the invention.

FIGS. 27A-K are side views of a flexure structure, illustrating thestructure at sequential steps of the manufacturing process according tothe flow chart of FIG. 26.

FIGS. 28A-C are side views of a flexure structure, illustrating thestructure at sequential steps of a manufacturing process to apply theground plane of FIG. 13.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is an illustration of a head suspension assembly 8 adapted foruse in a disk drive including a suspension component or flexure 10having an array of conductive leads 40 that include noble or near noblemetals and are manufactured by an additive process in accordance withone embodiment of the invention. Head suspension 8 includes a load beam30, to which the flexure 10 is attached, the load beam having anactuator arm mounting region 38 on a proximal end 31 adapted to mountthe head suspension assembly 8 to an actuator arm (not shown).

Flexure 10 is shown in greater detail in FIG. 2. Flexure 10 includes agenerally flat spring metal layer 20 having a gimbal region 14 locatedat a distal end 26 of the flexure, a mounting region 16 for mounting theflexure to a load beam 30, and a tail region 18 extending from themounting region at a proximal end 28 of the flexure. Spring metal layer20 is typically made of stainless steel or another suitable material.The gimbal region 14 of flexure 10 includes a tongue 22, defined by achannel 19 formed through the spring metal layer 20, that supports amagnetic head (not shown). The mounting region 16 is adapted to engagewith the load beam 30 and may include various tabs, apertures, andoffsets (not shown) to facilitate attachment with the load beam(typically by welding). The spring metal layer 20 of flexure 10 canassume a variety of shapes and sizes without departing from the scope ofthe invention.

Flexure 10 is a so-called integrated lead or wireless structure andincludes conductive traces or leads 40 that are applied to a majorsurface 21 of the spring metal layer 20. The conductive leads 40 provideelectrical communication between the magnetic head (not shown) that ismounted on the gimbal region 14 of flexure 10 and external circuitry(not shown), which is attached to the conductive leads on the tailregion 18 near the proximal end 28 of the flexure. Each conductive lead40 includes a head bonding pad portion 44 positioned on the gimbalregion 14 of flexure 10. The head bonding pad portion 44 of theconductive lead 40 is adapted to accept an attachment mechanism such asa solder ball or a gold ball to bond the magnetic head (not shown) tothe conductive lead.

In addition, each conductive lead 40 includes a primary conductorportion 52, which extends along some or all of the conductive lead. Theconductive lead 40 also includes a flying lead region 50, and a test padportion 46 located on the tail region 18 of the flexure 10. The flyinglead region 50 allows for access to the conductive lead 40 from both afirst major surface 21 and an opposing second major surface 23 (as shownon FIG. 4). The test pad portion 46 provides access to the conductivelead 40 for testing purposes.

Schematic representations of flexure 10 are shown in FIGS. 3 and 4. Theconductive leads 40 are applied along the first major surface 21 of thespring metal layer 20 of flexure 10. Flexure 10 includes, along with aplurality of conductive leads 40, a dielectric layer 24, and a coverlayer 36, both of which are made of a dielectric material such as aphotosensitive polyimide. In one embodiment, the entire conductive lead40 is made of gold. Gold conductive leads provide resistance tocorrosion not found in commonly used metals such as copper. Cover layer36 is applied over a majority of the conductive leads 40, but does notextend over a majority of the flying lead region 50, or over the testpad portion 46 and head bonding portion 44. Cover layer 36 providesprotection for the portion of the conductive leads 40 that are coveredby the cover layer.

FIG. 4 shows a side view schematic representation of a portion of theflexure 10 including the flying lead region 50 and test pad portion 46of one of the conductive leads 40. Dielectric layer 24 is appliedadjacent to the spring metal layer 20 to electrically isolate the springmetal layer from the conductive lead 40. The dielectric layer 24 extendsover a portion of the aperture 42 in spring metal layer 20 on each of afirst edge 41 and a second edge 43 of the aperture. The portion of thedielectric layer 24 that extends over the aperture 42 has a tapered edge25 that is tapered toward the spring metal layer 20.

In addition, a seed layer 34 of conductive material such as chromium orother suitable material is applied to the dielectric layer 24 so that itis located between the dielectric layer 24 and the conductive lead 40,including the portion of dielectric layer with a tapered edge 25. Whilethe dielectric material 24 can be applied over a substantial portion ofthe spring metal layer 20 beyond the area beneath the conductive leads40, the seed layer 34 is preferably limited to the areas between thedielectric layer 24 and the conductive leads 40 to prevent the seedlayer 34 from providing electrical communication between conductiveleads 40 that are intended to be electrically isolated from each other.

The conductive lead 40 is shown with a flying lead region 50 and a testpad portion 46. While, the schematic shows the test pad portion 46 andnot the head bond portion, the head bond portion have a similar oridentical structure as the test pad portion and be formed with similaror identical processes. The flying lead region 50 of conductive lead 40extends down the tapered edge 25 that extends over the aperture 42 fromeach of the first edge 41 and second edge 43 of the aperture and extendsacross the aperture 42 formed into the spring metal layer 20. The flyinglead region 50 extends across but not into the aperture 42 in theillustrated embodiment. In the illustrated embodiment, the primaryconductor portion 52 extends along the entire conductive lead 40,including the flying lead region 50 and the test pad portion 46.

Another feature of the flexure 10 are one or more standoffs 29positioned on the tongue 22. The standoffs 29 extend away from thespring metal layer 20 of the flexure 10 to support and position themagnetic head slider (not shown) when it is attached to the flexure 10.The standoffs 29 can include the same layers of materials appliedelsewhere on the flexure 10, including a dielectric layer 24, conductivematerial similar to conductive leads 40, and cover layer 36, althoughother materials may be used. The standoffs 29 are preferably the samethickness as the head bonding portion 44 to facilitate the attachment ofthe magnetic head (not shown) to the head bonding portion. In theembodiment illustrated in FIG. 3, three rectangular standoffs 29 arepositioned along a perimeter of the tongue 22. The number, shape, andposition of the standoffs, however, can vary without departing from thescope of the invention.

The cover layer 36 is applied over the dielectric layer 24 and theconductive leads 40 at locations other than the flying lead region 50and the test pad portion 46, leaving the conductive leads 40 exposed inthose areas. Thus, the flying lead region 50, in the illustratedembodiment, is exposed on both a first major surface 21 and a secondopposing surface 23. The flying lead region 50 is preferably made ofgold and has approximately the same thickness as the other portions ofthe conductive lead 40, although the flying lead region of theconductive lead may be wider than other portions of the conductive lead.

Schematic representations of flexure 110 in accordance with anotherembodiment of the invention are shown in FIGS. 5 and 6. Flexure 110includes conductive leads 140 that have additional layers of conductivematerial applied in the flying lead region 150 to strengthen the flyinglead region. The strengthened flying lead region 150 of the conductiveleads 140 facilitate improved connections between external conductorsand the flying lead region of the conductive leads. Conductive leads 140include a primary conductor portion 152 made of gold that extends acrosseach of the entire conductive leads, similar to the primary conductorportion 52 illustrated in conjunction with flexure 10. In addition, theflying lead region 150 of the illustrated embodiment includes a firstflying lead conductive layer 154 of gold applied onto the primaryconductor portion 152 in the flying lead region 150. Further, a secondflying lead conductive layer 156 applied onto the first flying leadconductive layer 154. Layer 156 is preferably constructed of nickel toprovide increased strength to the flying lead region 150. Further still,a third flying lead conductive layer 158 is applied onto the secondlayer 156. The third layer 158 is preferably formed from gold. Goldouter surfaces on the flying lead region 150 advantageously allow eitherside to accept ultrasonically welded conductors, gold being thepreferred material to ultrasonically weld to in electrical conductorapplications. Providing increased strength to the flying lead region 150allows improved connection between external conductors (not shown) andthe flying lead region and facilitates removal of the externalconductors for rework without damaging the conductive leads 140 in theflying lead region. With the exception of the flying lead region 150,flexure 110 can be similar to flexure 10 and similar features areidentified in the “1XX” series. For example, spring metal layer 120 canbe similar or identical to spring metal layer 20.

Schematic representations of flexure 210 in accordance with yet anotherembodiment of the invention are shown in FIGS. 7 and 8. Flexure 210includes a primary conductor portion 252 that has multiple conductivelayers formed of different materials. In addition, flying lead region250 includes multiple layers of materials to strengthen conductors 240,but the primary conductor portions do not extend into the flying leadregion. Thus, the flying lead regions can be formed from differentmaterials and applied after the primary conductor portions are applied.The primary conductor portions 252 of conductors 240 have a firstconductive layer 247 preferably including silver applied to the seedlayer 234 and a second conductive layer 249 preferably including goldapplied to the first conductive layer 247. The first conductive layer247 of silver provides increased conductivity through the primaryconductor portions 252 of the conductive lead 240. The second conductivelayer 249 of gold provides added corrosion protection for the firstlayer 247. In addition, the second conductive layer 249 of gold is anacceptable bonding material to which other conductors can be bonded, ifnecessary. While the first conductive layer 247 is preferably made ofsilver, it can be made of other materials, including copper, withoutdeparting from the scope of the invention.

Conductor 240 in the flying lead region 250 includes a first flying leadconductive layer 254 of gold. The first layer 254 is applied to theflexure from a first end 260, which is applied over a portion of theprimary conductor portions 252, and extends down the tapered edge 225that extends over the aperture 242 from each of the first 241 and second243 edges of the aperture. The first layer 254 of the flying lead region250 extends across but not into the aperture 242 formed into the springmetal layer 220. The first layer 254 has a second end 262, which isapplied onto the primary conductor portions 252 on an opposing side ofaperture 242 from the first end 260. Referring briefly to FIGS. 9-10, atlocations where the first layer 254 of the flying lead region 250 isapplied to the second layer 249 of the primary conductor portions 252,the first layer 254 is wider than the primary conductor portion to allowfor any misregistration that may occur during the additive manufacturingprocess.

Conductor 240 in the flying lead region 250 also includes a secondflying lead conductive layer 256 preferably of nickel and a third flyinglead conductive layer 258 of gold. The second layer 256, applied ontothe first layer 254, provides added strength to the flying lead region250. The third layer 258, applied unto the second layer 256 provides asuitable material to which a conductive lead (not shown) can beultrasonically welded. The second flying lead conductive layer 256 andthird flying lead conductive layers 258 are substantially the same widthas the first flying lead conductive layer 254 and thus are similarlywider than the primary conductor portion 252 at the first 260 and second262 ends of the flying lead region. Cover layer 236 can be applied overpart of the third flying lead conductive layer 258 of conductive lead240 including that portion that overlaps the primary conductor portions252. With the exception of the particular differences discussed above,flexure 210 can be similar to flexure 110 and similar features areidentified in the “2XX” series. In particular, the test pad portion 246is similar or identical to test pad portion 146.

Schematic representations of flexure 310 in accordance with yet anotherembodiment of the invention are shown in FIGS. 11 and 12. Like flexure210, flexure 310 includes a conductor 340 with a flying lead region 350having multiple layers of material to provide added strength and primaryconductor portions 352 that do not extend into the flying lead region.Further, flexure 310 includes test pad portions 346 with multipleconductive layers to provide added strength. Similarly, head bond padportions 344 can also include multiple conductive layers.

Conductive leads 340 preferably include primary conductor portions 352formed of silver, which advantageously provides improved conductivity.As with the first conductive layer 247 of primary conductor portion 252of the embodiment described above, primary conductor portion 352 can bemade of copper without departing from the scope of the invention. Inaddition, conductive leads 340 include a test pad portion 346 having afirst test pad conductive layer 364 of gold, a second test padconductive layer 366 of nickel, and a third test pad conductive layer368 of gold. Similar to the flying lead region 250 of flexure 210, thetest pad portion 346 includes an overlapping interface 376 where thetest pad portion 346 is applied over and is wider than a portion of theprimary conductor portions 352 that interfaces the test pad portion.Similarly, the cover layer 336 is applied over a portion of the test padportion 346, so that only a portion of the test pad portion is exposed.Further, a portion of the spring metal layer 320, dielectric layer 324,and seed layer 334 located beneath the test pad portion 346 may beremoved to allow for access to the test pad portion from a second majorsurface 323 of the flexure 310. With the exception of the particulardifferences in the features described herein, flexure 310 can besubstantially similar to flexure 210 and similar features are identifiedin the “3XX” series.

In accordance with another embodiment of the invention, FIG. 13illustrates a side view of a portion of a flexure 410 that includesconductive leads 440 with a ground plane 470 positioned between adielectric layer 424 and a spring metal layer 420. Ground plane 470 isadvantageously positioned between conductive leads 440 and the springmetal layer 420 and can be selectively applied along any portion of thespring metal layer 420. The ground plane 470 is effectively encasedbetween the dielectric layer 424 and the spring metal layer 420, so thatit does not require any additional protection. The ground plane 470 isformed from conductive material, and is preferably formed from silver,but can also be formed from copper, nickel, aluminum, gold or alloys ofthese materials. In an alternative embodiment (not shown), a portion ofa conductive lead 440 may be directly positioned adjacent to the groundplane 470 without any intervening dielectric material. In thisalternative embodiment, the conductive lead that is in contact with theground plane is thus grounded to the spring metal layer through theground plane. The thickness of ground plane 470 can vary over the springmetal layer 420. With the exception of the inclusion of a ground plane470, flexure 410 can be similar to, or substantially the same as,flexure 10 and similar features are identified in the “4XX” series. Theground plane feature described in this embodiment can be included withany other embodiment without departing from the scope of the invention.

FIG. 14 is a side view of a portion of flexure 510 in accordance withyet another embodiment of the invention. Flexure 510 includes aconductive lead 540 that is in electrical communication with springmetal layer 520. Conductive lead 540 is shown with a first conductivelayer 554 preferably of gold. At least a portion of the first conductivelayer 554 of conductive lead 540 is applied to and in electricalcommunication with spring metal layer 520 along a gap 517 in adielectric layer 524. Other portions of the first conductive layer 554of conductive lead 540 may be positioned applied to the dielectric layer524 over portions of the flexure 510. The conductive lead 540 in theillustrated embodiment includes a second conductive layer 556 made ofnickel applied onto the first conductive layer 554. In addition, theconductive lead 540 includes a third conductive layer 558 made of goldand applied onto the second conductive layer 556. The grounding featureshown in this embodiment can be combined with other embodimentsdescribed above without departing from the scope of the invention.

The previously described embodiments are described for illustrativepurposes. The conductive leads described above in these previousembodiments can include variations from those described withoutdeparting from the scope of the invention. For example, the flying leadregion, primary conductor portion, test pad portion and head bond padportion of any of the above embodiments may be matched together to formnew embodiments of the current invention, without departing from thescope thereof. In addition, other arrangements of materials may be usedwithin each of the portions outlined above. As one example, the primaryconductor portions of a conductive lead may include copper or nickel. Inaddition, although the conductive leads of the embodiments describedabove are adapted to provide electrical communication between anexternal conductor and a magnetic head mounted on the flexure, otherconductive leads may be adapted to provide electrical communication inother circuits without departing from the scope of the invention.

As has been described above in conjunction with flexures 110, 210, and310, the flying lead region can include multiple layers of differingmaterials such as nickel to create strong conductive leads in the flyinglead region. Alternatively, the flying lead region of the conductiveleads can be reinforced with other structures to provide additionalstrength. FIGS. 15A-C illustrate a portion of flexure 10 a havingconductive leads 40 a with an attached reinforcement member 82 a in aflying lead region 50 a in accordance with another embodiment of theinvention. FIG. 15A illustrates a cross-sectional view of flexure 10 ataken through a longitudinal axis of one conductive lead 40 a in theflying lead region 50 a. The dielectric layer 24 a extends further overthe aperture 42 a of spring metal 20 a than previously discussedembodiments. The conductive leads 40 a are applied along the dielectriclayer 24 a on each of a first edge 41 a and second edge 43 a of theaperture 42 a uncovered by cover layer 36 a.

The reinforcement member 82 a includes an island of spring metal 72 athat is attached to each of the conductive leads 40 a in the flying leadregion 50 a and is approximately the same width as the conductive lead40 a to which it is attached. While the isolated spring metal portions72 a may be planar with the spring metal layer 20 a of flexure 10 a,they are not physically integral to the spring metal layer. The islandof spring metals 72 a extend toward, and are attached to, a portion ofthe dielectric layer 24 a on each end of the island of spring metal 72a.

A first conductive reinforcing layer 84 a of conductive material isapplied to and surrounds the portion of each the conductive leads 40 anot covered by cover 36 a. In addition, the first reinforcing layer 84 ais applied to and surrounds the island of spring metal 72 a. In oneembodiment, the first reinforcing layer 84 a includes nickel to provideadditional strength to the conductive lead 40 a. Each conductive lead 40a also includes a second reinforcing layer 86 a that is applied to andsurrounds the first reinforcing layer 84 a. In one embodiment, thesecond reinforcing layer 86 a includes gold. As is shown in FIG. 15C,the dielectric layer 24 a is positioned in between a portion of theconductive lead 40 a and island of spring metal 72 a and also separatesthe first conductive layer 84 a and second layer 86 a on each end of thereinforcement member 82 a. With the exception of the reinforcement addedto the conductive lead 40 a in the flying lead region 50 a, flexure 10 ais similar to or substantially identical to flexure 10 and similarfeatures are identified in the “XXa” series.

FIGS. 16A-C show flexure 10 b having conductive leads 40 b with anattached reinforcement member 82 b in a flying lead region 50 b inaccordance with another embodiment of the invention. FIG. 16Aillustrates a cross-sectional view of a flexure 10 b taken through alongitudinal axis of one conductive lead 40 b in the flying lead region50 b showing a reinforcement member 82 b having isolated spring metalportions 72 b and 73 b that provide reinforcement for each conductivelead. Conductive leads 40 b are applied along the dielectric layer 24 bon each of a first edge 41 b and second edge 43 b of the aperture 42 buncovered by cover layer 36 b.

The reinforcement member 82 b includes an island of spring metal 72 bthat is attached to each of the conductive leads 40 b in the flying leadregion 50 b and is approximately the same width as the conductive lead40 b to which it is attached. While the isolated spring metal portions72 b may be planar with the spring metal layer 20 b of flexure 10 b,they are not physically integral to the spring metal layer. The islandof spring metal 72 b extends toward, and is attached to, a portion ofthe dielectric layer 24 b on each end of the island of spring metal 72b.

A first conductive reinforcing layer 84 b of conductive material isapplied to and surrounds the portion of each the conductive leads 40 bnot covered by cover 36 b. In addition, the first reinforcing layer 84 bis applied to and surrounds the island of spring metal 72 b. In oneembodiment, the first reinforcing layer 84 b includes nickel to provideadditional strength to the conductive lead 40 b.

Each conductive lead 40 b also includes a second reinforcing layer 86 bthat is applied to and surrounds the first reinforcing layer 84 b. Inthe illustrated embodiment, the second reinforcing layer 86 b includesgold. As is shown in FIG. 16C, the dielectric layer 24 b is positionedin between a portion of the conductive lead 40 b and island of springmetal 72 b and also separates the first conductive layer 84 b and secondlayer 86 b on each end of the reinforcement member 82 b.

Additionally, the dielectric layer 24 b has apertures 88 b formedthrough it on each side of the dielectric layer 24 b that extends overthe aperture 42 b. An island of spring metal 73 b is attached to theconductive layer underneath each of the apertures 88 b. Conductive lead40 b extends into each of the apertures 88 b and is electrically andmechanically connected to the island of spring metal 73 b to anchor theconductive lead 40 b through the conductive layer 24 b to the island ofspring metal, thereby providing additional strength to the flying leadregion 50 b. With the exception of the reinforcement member added to theconductive lead 40 b in the flying lead region 50 b, flexure 10 b issimilar to or substantially identical to flexure 10 and similar featuresare identified in the “XXb” series.

The reinforcement members described above in conjunction with FIGS.15A-C and 16A-C include an island of spring metal attached to aconductive lead on a flexure similar to flexure 10. While flexure 10includes conductive leads 40 preferably made of gold, alternatively, allor parts of the conductive leads 40 a and 40 b, including portions inthe flying lead region 50 a and 50 b may be made of other materials suchas copper. The island of spring metal provides strength to the flyinglead region, but also protects the conductive leads from etchingprocesses that might otherwise compromise the integrity of a conductivelead made of materials such as copper during the manufacturing processas described below.

FIGS. 17A-C show still another alternative embodiment of a flexure 10 chaving conductive leads 40 c with an attached reinforcement member 82 cin a flying lead region 50 c. FIG. 17A illustrates a cross-sectionalview of a flexure 10 c taken through a longitudinal axis of oneconductive lead 40 c in the flying lead region 50 c showing areinforcement member 82 c having isolated spring metal portions 73 c andlayers of conductive reinforcing material that provide reinforcement foreach conductive lead.

A first conductive reinforcing layer 84 c of conductive material isapplied to and surrounds the portion of each the conductive leads 40 cnot covered by cover 36 c. In one embodiment, the first reinforcinglayer 84 c includes nickel to provide additional strength to theconductive lead 40 c. Each conductive lead 40 c also includes a secondreinforcing layer 86 c that is applied to and surrounds the firstreinforcing layer 84 c. In the illustrated embodiment, the secondreinforcing layer 86 c includes gold. As is shown in FIG. 17C, thedielectric layer 24 c separates part of the first conductive layer 84 band second layer 86 c near each end of the reinforcement member 82 c.

Additionally, the dielectric layer 24 c has apertures 88 c formedthrough it on each side of the dielectric layer 24 c that extends overthe aperture 42 c. An island of spring metal 73 c is attached to theconductive layer underneath each of the apertures 88 c. Conductive lead40 c extends into each of the apertures 88 c and is electrically andmechanically connected to the island of spring metal 73 c to anchor theconductive lead 40 c through the conductive layer 24 c to the island ofspring metal, thereby providing additional strength to the flying leadregion 50 c. With the exception of the reinforcement added to theconductive lead 40 c in the flying lead region, flexure 10 c is similarto or substantially identical to flexure 10 and similar features areidentified in the “XXc” series.

FIGS. 18A and B show still another alternative embodiment of a flexure10 d having conductive leads 40 d with an attached reinforcement member82 d in a flying lead region 50 d. FIG. 18A illustrates across-sectional view of a flexure 10 d taken through a longitudinal axisof one conductive lead 40 d in the flying lead region 50 d showing areinforcement member 82 d having layers of conductive reinforcingmaterial that provide reinforcement for each conductive lead. Flexure 10d has a spring metal layer 20 d having an aperture 42 d. A portion ofthe dielectric layer 24 d extends over a proximal edge 41 d and a distaledge 43 d of aperture 42 d in spring metal layer 20 d. Cover layer 36 dextends beyond the edges of the dielectric layer 24 d to cover a portionof the conductive leads 40 a that extend over the aperture 42 d.

A first conductive reinforcing layer 84 d of conductive material isapplied to and surrounds the portion of each the conductive leads 40 dnot covered by cover 36 d. In one embodiment, the first reinforcinglayer 84 d includes nickel to provide additional strength to theconductive lead 40 d. Each conductive lead 40 d also includes a secondreinforcing layer 86 d that is applied to and surrounds the firstreinforcing layer 84 d. In the illustrated embodiment, the secondreinforcing layer 86 d includes gold. With the exception of thereinforcement added to the conductive lead 40 d in the flying leadregion, flexure 10 d is similar to or substantially identical to flexure10 and similar features are identified in the “XXd” series.

FIGS. 19A-C show still another alternative embodiment of a flexure 10 ehaving conductive leads 40 e with an attached reinforcement member 82 ein a flying lead region 50 e including layers of reinforcing conductivematerial and formations in a cover 36 e to relieve stress that may beinduced in the conductive leads 40 e in the flying lead region 50 e.FIG. 19A illustrates a cross-sectional view of a flexure 10 e takenthrough a longitudinal axis of one conductive lead 40 e in the flyinglead region 50 e showing a reinforcement member 82 e having layers ofconductive reinforcing material that provide reinforcement for eachconductive lead. Flexure 10 e has a spring metal layer 20 e having anaperture 42 e over which conductive leads 40 e extend. Dielectric layer24 e extends over a proximal edge 41 e and a distal edge 43 e ofaperture 42 e in the spring metal layer 20 e. Part of the conductiveleads 40 e that are applied to the dielectric layer 24 e extend outfrom, and are not covered by, the cover layer 36 e on each side of eachof the flying lead region 50 e.

A first conductive reinforcing layer 84 e of conductive material isapplied to and surrounds the portion of each the conductive leads 40 ein the flying lead region 50 e not covered by cover 36 e. In oneembodiment, the first reinforcing layer 84 e includes nickel to provideadditional strength to the conductive lead 40 e. Each conductive lead 40e also includes a second reinforcing layer 86 e that is applied to andsurrounds the first reinforcing layer 84 e. In the illustratedembodiment, the second reinforcing layer 86 e includes gold

Additionally, as is shown in FIG. 19C, which is a view taken from thefirst major surface 21 e of the flexure 10 e, cover layer 36 e includesnotches 98 e formed into the cover layer 36 e on each side of theaperture 42 e into which the first 84 e and second 86 e layers ofmaterial extend. The notches 98 e absorb stress from the reinforcementmember 82 e through the first 84 e and second 86 e layers. With theexception of the differences described here with respect toreinforcement member 82 e, flexure 10 c is substantially similar toflexure 10 and similar features are identified in the “XXe” series.

The embodiments above describe conductive leads on a flexure that areresistant to corrosion, have a strong flying lead region, and allow foraccess to the conductive leads through the flexure in one or morelocations. FIG. 20 outlines the steps in a flowchart for one embodimentof an additive process 610 for manufacturing conductive leads 40 ontospring metal layer 20 of flexure 10 as shown in FIG. 3. FIGS. 21A-Lillustrate flexure 10 after sequential steps of the additive process ofFIG. 20. FIG. 21A illustrates flexure 10 after the step 612 of applyinga photosensitive polyimide material to form a dielectric layer 24 ontothe spring metal layer 20. A photolithography process can be used toapply and pattern the polyimide material on the spring metal layer 20.While the dielectric layer 24 can extend over a large portion of springmetal layer 20, the dielectric layer is patterned to have a gap over aportion 27 of the spring metal layer 20 where aperture 42 (as shown inFIG. 3) will eventually be formed. The thickness of the dielectric layer24 decreases near the portion 27, so as to form a tapered edge 25 on thedielectric layer. While the dielectric layer 24 may be applied to mostof the rest of the spring metal layer 20, it need only be applied toareas where it is desirable to isolate the spring metal layer 20 fromthe conductive leads 40 that will be formed on the flexure 10.

FIG. 21B illustrates flexure 10 after a subsequent step 614 of applyinga seed layer 34 onto the flexure 10. The seed layer 34 can be applied tothe flexure 10 by employing a vacuum deposition process or other knownprocesses to sputter seed layer material onto the surface of theflexure. The seed layer 34 will be used as an electrical referenceduring a subsequent plating process. It should be noted that while thedielectric layer 24 is not applied onto the portion 27, the seed layer34 is applied onto portion 27.

Referring to FIGS. 21C-E, a subsequent step is the step 616 of platingconductive leads 40 onto the flexure 10. Prior to plating the conductiveleads 40, a mask of resist material 90 is applied and patterned onto thefirst major surface 21 using a photolithography process to define whereit is and is not desired to have conductive leads 40 added to theflexure 10. Once the mask of resist material 90 has been applied andpatterned, the gold conductive leads 40 are plated to the flexure 10along the first major surface 21 in areas where there is no resistmaterial 90. Conventional electroplating or electroless platingprocesses can be used for this purpose. After the conductive leads 40have been plated onto the flexure 10, the resist material 90 is removedfrom the flexure 10.

FIG. 21F illustrates a subsequent step 618 of removing that portion ofthe seed layer 34 from the flexure 10 that is not covered by conductiveleads 40. The seed layer 34 can be removed by a chemical etching processor other known processes, leaving conductive leads 40 and dielectriclayer 24 covering the first major surface 21. Referring to FIG. 21G, asubsequent step is the step 620 of applying cover layer 36 onto flexure10. The cover layer 36 is applied primarily over portions of theconductive leads 40 and surrounding areas of the first major surface 21,leaving some or all of the flying lead region 50, test pad portions 46and head bond pad portion (not shown) free from coverage by the coverlayer. The cover layer 36 is preferably a photosensitive polyimidesimilar or identical to the material used for the dielectric layer 24and is applied with a similar photolithography process.

FIG. 21H illustrates the results of a subsequent step 622 of etchingspring metal layer 20 and seed layer 34 away from a portion of a secondmajor surface 23 of the flexure 10 to create an aperture 42 that allowsaccess to the conductive leads 40 from the second major surface.Photolithography, ferric chloride-based etching, or other knownprocesses can be used to perform step 622. Additional spring layerremoval may alternatively be performed to create apertures (not shown)to allow access from the second major surface 23 for the test padportion 46 and/or the head bond pad portion (not shown).

FIGS. 21I-L illustrate the step 622 of etching spring metal layer 20 andseed layer 34 away from a portion of a second major surface 23 of theflexure 10. FIG. 21I is a cross section of flexure 10 taken through theflying lead region 50 of FIG. 21G, that is, prior to the creation ofaperture 42. Four conductive leads 40 are shown positioned above theseed layer 34, all of which is positioned over spring metal layer 20. InFIG. 21J, a mask of resist material 92 is applied and patterned onto thefirst major surface 21 and second major surface 23 using aphotolithography process. The mask defines a portion of the second majorsurface 23 where it is desirable to create aperture 42. The resistmaterial 92 is resistant to the etchant used to create the aperture 42in the spring metal layer 20 and preferably applied and patterned usinga photolithography process.

Once the resist material 92 has been applied and patterned, the flexure10 is exposed to an etchant (not shown) to form the aperture 42 as isshown in FIG. 21K. The etchant will, in one embodiment also remove theseed layer 34 that is applied to the conductive leads 40 that extendover the newly created aperture 42. Because the etchant does not reactwith gold, the conductive leads 40 leads are not affected by the etchingprocess. While the conductive leads 40 that extend over the aperture 42are made exclusively of gold, in other embodiments, such as flexure 110as shown in FIG. 6, conductive layers of the flying lead region are madeof materials other than gold. In these other embodiments, it isimportant that gold layers adjacent to the spring metal, such as acombination of the primary conductor portion 152 and first flying leadconductive layer 154 of flexure 110, be thick enough to prevent wickingbetween the conductive lead and resist material so as to protect otherlayers. While gold is resistant to the etching, other materials, such asnickel or copper, are susceptible to the etchant used during the processof creating an aperture 142 into the spring metal layer 120 and must beprotected or they will be etched. Referring to FIG. 21L, after theetching process the resist material 92 is removed, leaving a flying leadregion 50 with conductors 40 that extend over the aperture 42 formedinto the spring metal layer 20.

While step 622 of etching the spring metal layer 20 of flexure 10 isdescribed above as creating aperture 42 through the spring metal layer20, it should be understood that by applying the resist material 92using other patterns, the aperture formed may be different from theaperture 40 of flexure 10. For example, the apertures 42 a, 42 b, and 42c of flexures 10 a, 10 b and 10 c, respectively, as shown in FIGS. 15A,16A, and 17A, may be etched to define islands of spring metal 72 a, 72b, 73 b, 73 c, and other similar configurations.

FIGS. 22 and 23A-K illustrate steps in another embodiment of an additiveprocess 710 for manufacturing the conductive leads 140 onto the springmetal layer 120 of flexure 110 shown in FIGS. 5 and 6. One step,illustrated in FIG. 23A, is the step 712 of applying a photosensitivepolyimide material to form a dielectric layer 124 onto the spring metallayer 120. A photolithography process used to apply and pattern thepolyimide material. While the dielectric layer 124 can extend over alarge portion of spring metal layer 120, the dielectric layer ispatterned to have a gap over a portion 127 of the spring metal layer 120where aperture 142 (as shown in FIG. 5) will eventually be formed. Thethickness of the dielectric layer 124 typically decreases near theportion 127, so as to form a tapered edge 125 on the dielectric layer.While the dielectric layer 124 may be applied to most of the rest of thespring metal layer 120, it need only be applied to areas where it isdesirable to isolate the spring metal layer 120 from the conductiveleads 140 that will be formed on the flexure 110.

A subsequent step, illustrated in FIG. 23B, is a step 714 of applying aseed layer 134 onto the flexure 110. The seed layer 134 can be appliedto the flexure 110 by employing a vacuum deposition process or otherknown processes to sputter seed layer material onto the surface of theflexure. The seed layer 134 will be used as an electrical referenceduring a subsequent plating process. It should be noted that while thedielectric layer 124 is not applied over the portion 127, the seed layer134 is applied onto portion 127.

Another subsequent step, illustrated in FIGS. 23C-E, is a step 716 ofplating primary conductor portion 152 of conductive leads 140 onto theseed layer 134 of flexure 110. Prior to plating the primary conductorportion 152, a mask of resist material 190 is applied and patterned ontothe first major surface 121 using a photolithography process to definewhere it is and is not desired to have primary conductor portion 152added to the flexure 110.

Once the resist material 190 has been applied and patterned, the goldprimary conductor portions 152 of the conductive leads 140 are plated tothe flexure 110 along the first major surface 121 in areas where thereis no resist material 190. As in the previously described embodiment,electroplating processes can be used to plate the primary conductorportions 152. After the primary conductor portions 152 have been platedonto the flexure 110, the resist material 190 is removed from theflexure 110.

Still another subsequent step, illustrated in FIGS. 23F-H, is the step717 of performing secondary plating operations on the flying lead region150. Prior to the performing the secondary plating operation, portionsof the first major surface 121 of flexure 110 are covered with a mask ofresist material 190 to cover those parts of the flexure not intended toreceive plating in a secondary plating operation. Once the mask ofresist material 190 has been applied, the secondary plating operation isperformed on the conductive leads 140 in the flying lead region 150using electroplating or electroless plating processes. In oneembodiment, a first flying lead conductive layer 154 of gold is platedonto the flexure 110 as part of the secondary process. In a subsequentplating operation, a second flying lead conductive layer 156 of nickelis applied onto the first layer 154. In yet another subsequent platingoperation, a third flying lead conductive layer 158 of gold is appliedto the second layer 156. While the first flying lead conductive layer154, the second flying lead conductive layer 156, and the third flyinglead conductive layer 158 are described as being gold, nickel, and gold,respectively, other materials or combinations of materials may be usedto form the flying lead region, including silver, copper, variousalloys, including gold alloys. Portions of conductive leads 140 inflying lead region 150 that are accessible along major surfaces 121 and123 of flexure 110, however, are preferably formed of gold. After thesecondary plating operations are completed, the resist material 190 isremoved from the flexure 110, using processes described above leavingthe flexure as shown in FIG. 23H.

FIG. 23I illustrates a subsequent step 718 of removing that portion ofthe seed layer 134 from the flexure 110 that is not covered byconductive leads 140. The seed layer 150 is removed with an etching orother known process, leaving conductive leads 140 and dielectric layer124 covering the first major surface 121.

Referring to FIG. 23J, a subsequent step is the step 720 of applyingcover layer 136 onto flexure 110. The cover layer 136 is appliedprimarily over primary conductor portions 152 of the conductive leads140 and surrounding areas of the first major surface 121, leaving theflying lead region 150, test pad portion 146, and head bond pad portion(not shown) free from coverage by the cover layer. Part of the primaryconductor portions 152 may also be uncovered by the cover layer 136without departing from the scope of the invention. The cover layer 136is applied as described above in conjunction with step 620 of method610.

FIG. 23K illustrates the results of a subsequent step 722 of etchingspring metal layer 120 and seed layer 134 away from a portion of asecond major surface 123 of the flexure 110. Step 722 creates anaperture 142 that allows access to the flying lead region 150 of theconductive leads 140 from the second major surface 123. Additionaletching may alternatively be performed to create apertures (not shown)to allow access from the second major surface 123 for the test padportion 146, the head bond pad portion (not shown), or both. The etchingand photolithography processes of the type identified above can be usedto form aperture 142. It should be noted that the thickness of the firstflying lead conductive layer 154 is important to prevent etchant fromcompromising the integrity of the second flying lead conductive layer156, which may not be resistant the etchant.

FIGS. 24 and 25A-K illustrate steps in another embodiment of an additiveprocess 810 for manufacturing conductive leads 240 onto the flexure 210as is shown in FIGS. 7 and 8 above. One step, illustrated in FIG. 25A,is the step 812 of applying a photosensitive polyimide material to forma dielectric layer 224 onto the spring metal layer 220. Conventionalphotolithography processes are used to apply and pattern the polyimidematerial and includes applying the polyimide material. The thickness ofthe dielectric layer 224 decreases near the portion 227, so as to form atapered edge 225 on the dielectric layer. While the dielectric layer 224may be applied to most of the rest of the spring metal layer 220, itneed only be applied to areas where it is desirable to isolate thespring metal layer 220 from the conductive leads 240 that will be formedon the flexure 210.

A subsequent step, illustrated in FIG. 25B, is a step 814 of applying aseed layer 234 onto the flexure 210. The seed layer 234 can be appliedto the flexure 210 by employing a vacuum deposition or otherwise knownprocess to sputter seed layer material onto the surface of the flexure.The seed layer 234 will be used as an electrical reference during asubsequent plating process. It should be noted that while the dielectriclayer 224 is not applied over the portion 227, the seed layer 234 isapplied onto portion 227.

FIGS. 25C-E show a step 816 of plating primary conductor portions 252 ofconductive leads 240 onto the seed layer 234 of flexure 210. Prior toplating the primary conductor portions 252, resist material 290 isapplied using methods described above to portions of a first majorsurface 221 to create a mask of protected portions and exposed portions.Protected portions overlay areas to be protected from subsequentdeposition of conductive materials during subsequent plating processes.Exposed portions overlay areas for subsequent deposition of conductivematerials. It should be noted that the resist material is applied intoareas where flying lead regions have been plated in previous embodimentsthereby preventing the primary conductor portions 252 from extendinginto the flying lead region 250.

Once the resist material 290 has been applied, primary conductorportions 252 of the conductive leads 240 are plated onto the majorsurface 221. The primary conductor portions 252, in this embodiment,include a first conductive layer 247, preferably made of silver althoughother materials including copper may be used, applied to the seed layer234. After the first conductive layer 247 is plated, a second platingoperation is performed to plate a second conductive layer 249 of goldonto the first layer 247. After the plating operations are completed,the resist material 290 is removed from the first major surface 221 ofthe flexure 210 as is shown in FIG. 25E, leaving the primary conductorportions 252 of the conductive leads 240.

Still another subsequent step, illustrated in FIGS. 25F-H, is the step817 of performing secondary plating operations on the conductive leads240. Prior to the performing the secondary plating operations, a mask ofresist material 290 is applied to the first major surface 221 of flexure210 using a photolithography process to define what portions of themajor surface will be exposed for subsequent plating operations.

Once the resist material 290 has been applied, the secondary platingoperation is performed on the conductive leads 240 in the flying leadregion 250 using plating processes of the type identified above. In oneembodiment, a first flying lead conductive layer 254 of gold is platedalong a path between a first end 260 and a second end 262. The firstflying lead conductive layer 254 is plated onto a portion of the secondlayer 249 of the primary conductor portion 252 that is not covered bythe resist material 290, a portion of the dielectric layer 224 extendingout from the primary conductor portion 252, down a tapered edge 225, andacross a portion 227 of the spring metal layer 220. In a subsequentplating operation, a second flying lead conductive layer 256 of nickelis applied onto the first flying lead conductive layer 254. In yetanother subsequent plating process, a third flying lead conductive layer258 of gold is applied to the second flying lead conductive layer 256.It should be noted that the flying lead conductive layers 254, 256, and258 overlap the primary conductor portions 252 to allow formisregistration during the secondary plating process as is diagrammed inFIGS. 9 and 10.

While the first flying lead conductive layer 254, second flying leadconductive layer 256, and third flying lead conductive layers 258 addedin the secondary plating operations are described as being gold, nickel,and gold, respectively, other materials or combinations of materials canbe used to form the conductive leads 240 in the flying lead region,including silver, copper, and various alloys. Portions of conductiveleads 240 in flying lead region 250 that are accessible along majorsurfaces 221 and 223 of flexure 210, however, are preferably formed ofgold to advantageously provide a desired surface to which conductors(not shown) can be ultrasonically welded. After the secondary platingoperations are completed, the resist material 290 is removed from theflexure 210, using processes described above.

FIG. 25I illustrates a subsequent step 818 of removing that portion ofthe seed layer 234 from the flexure 210 that is not covered by completedconductive leads 240. The seed layer 250 is removed by etching or otherknown processes, leaving conductive leads 240 and dielectric layer 224covering the first major surface 221.

Referring to FIG. 25J, a subsequent step is the step 820 of applyingcover layer 236 onto flexure 210. The cover layer 236 is appliedprimarily over primary conductor portions 252 of the conductive leads240 and surrounding areas of the first major surface 221, leaving partof the conductive leads 240 in the flying lead region 250, the test padportion 246, and the head bond pad portion (not shown) free fromcoverage by the cover layer. Part of the primary conductor portions 252may also be uncovered by the cover layer 236 without departing from thescope of the invention. The cover layer 236 is applied as describedabove in conjunction with step 620 of method 610.

FIG. 25K illustrates the results of a subsequent step 822 of etchingspring metal layer 220 and seed layer 234 from a portion of a secondmajor surface 223 of the flexure 210. Step 822 creates an aperture 242that allows access to the flying lead region 250 from the second majorsurface 223. Additional etching may alternatively be performed to createapertures (not shown) to allow access from the second major surface 223for the test pad portion 246 and the head bond pad portion (not shown).Aperture 242 can be formed by photolithography and etching processessimilar to those identified above with respect to FIGS. 21I-L. It shouldbe noted that the first flying lead conductive layer 254 should be thickenough to prevent etching material from wicking up to, and compromisingthe integrity of, the second flying lead conductive layer 256, which maynot be resistant the etchant.

FIGS. 26 and 27A-K illustrate steps in another embodiment of an additiveprocess 910 for manufacturing conductive leads 340 onto the flexure 310as is shown in FIGS. 11 and 12 above. One step, illustrated in FIG. 25A,is the step 912 of using a photolithography process of the typedescribed above to form a dielectric layer 324 onto a portion the springmetal layer 320. The thickness of the dielectric layer 324 decreasesnear a portion 327 of the spring metal layer 320 where no dielectriclayer 324 is applied, so as to form a tapered edge 325 on the dielectriclayer. While the dielectric layer 324 may be applied to most of the restof the spring metal layer 320, it need only be applied to areas where itis desirable to isolate the spring metal layer 320 from the conductiveleads 340 that will be formed on the flexure 310.

A subsequent step, illustrated in FIG. 27B, is a step 914 of applying aseed layer 334 onto the flexure 310. The seed layer 334 can be appliedto the flexure 310 by employing a vacuum deposition process or otherknown processes to sputter seed layer material onto the surface of theflexure. The seed layer 334 will be used as an electrical referenceduring a subsequent plating process. It should be noted that while thedielectric layer 324 is not applied onto the portion 327, the seed layer334 is applied onto portion 327.

FIGS. 27C-E show a step 916 of plating primary conductor portions 352 ofconductive leads 340 onto the seed layer 334 of flexure 310. Prior toplating the primary conductor portions 352, a resist material 390 isapplied using methods of the type described above to portions of a firstmajor surface 321 to create a mask of protected portions and exposedportions. Protected portions overlay areas to be protected fromsubsequent deposition of conductive materials during subsequent platingprocesses. Exposed portions overlay areas for subsequent deposition ofconductive materials. It should be noted that the resist material isapplied into areas where flying lead regions have been plated inprevious embodiments thereby preventing the primary conductor portions352 from extending into the flying lead region 350.

Once the resist material 390 has been applied, primary conductorportions 352 of the conductive leads 340, which are preferably made ofsilver but can also be made of other materials, including copper, areplated onto the major surface 321. After the plating operations arecompleted, the resist material 390 is removed from the first majorsurface 321 of the flexure 310 as is shown in FIG. 27E, leaving theprimary conductor portions 352 of the conductive leads 340.

Still another subsequent step, illustrated in FIGS. 27F-H, is the step917 of performing secondary plating operations on the conductive leads340. Prior to the performing the secondary plating operations, a mask ofresist material 390 is applied to the first major surface 321 of flexure310 using a photolithography process to define what portions of themajor surface will be exposed for subsequent plating operations.

Once the resist material 390 has been applied, the secondary platingoperation is performed on the conductive leads 340 in the flying leadregion 350 and a portion of at test pad portion 346 and/or the head bondpad portion (not shown) using a process of the type described above. Inthis embodiment, a first flying lead conductive layer 354 of flying leadregion 350 of gold is plated along a path from a first end 360 to asecond end 362, following a contour created by materials such as theprimary conductor portions 352 previously applied to the first majorsurface 321 of the flexure 310. In a subsequent plating operation, asecond flying lead conductive layer 356 of nickel is applied onto thefirst flying lead conductive layer 354. In yet another subsequentplating process, a third flying lead conductive layer 358 of gold isapplied to the second flying lead conductive layer 356. It should benoted that the flying lead conductive layers 354, 356, and 358 overlapthe primary conductor portions 352 to allow for misregistration duringthe secondary plating process as is diagrammed in FIGS. 9 and 10 inconjunction with a previously described embodiment.

While the first flying lead conductive layer 354, second flying leadconductive layer 356, and third flying lead conductive layer 358 addedin the secondary plating operations are described as being gold, nickel,and gold, respectively, other materials or combinations of materials maybe used, including silver, copper, and various alloys. Portions ofconductive leads 340 in flying lead region 350 that are accessible alongmajor surfaces 321 and 323 of flexure 310, however, are preferablyformed of gold to advantageously provide a desired surface to whichconductors (not shown) can be ultrasonically welded. After the secondaryplating operations are completed, the resist material 390 is removedfrom the flexure 310, using processes of the type described above.

FIG. 27I illustrates a subsequent step 918 of removing that portion ofthe seed layer 334 from the flexure 310 that is not covered by completedconductive leads 340. The seed layer 350 is removed by etching or otherknown processes, leaving conductive leads 340 and dielectric layer 324covering the first major surface 321 of flexure 310.

Referring to FIG. 27J, a subsequent step is the step 920 of applyingcover layer 336 onto flexure 310. The cover layer 336 is appliedprimarily over primary conductor portions 352 of the conductive leads340 and surrounding areas of the first major surface 321, leaving partof the flying lead region 350, the test pad portion 346, and the headbond pad portion (not shown) free from coverage by the cover layer. Partof the primary conductor portions 252 can also be uncovered by the coverlayer 336 without departing from the scope of the invention. The coverlayer 336 is applied as described above in conjunction with step 620 ofmethod 610.

FIG. 25K illustrates the results of a subsequent step 922 of etchingspring metal layer 320 and seed layer 334 away from a portion of asecond major surface 323 of the flexure 310. Step 922 creates anaperture 342 that allows access to the flying lead region 350 from thesecond major surface 323. Additional etching may alternatively beperformed to create apertures (not shown) allow access from the secondmajor surface 323 for the test pad portion 346 and/or the head bond padportion (not shown). Aperture 342 can be formed by photolithography andetching processes similar to those identified above with respect toFIGS. 21I-L. It should be noted that the first flying lead conductivelayer 354 should be thick enough to prevent etching material fromwicking up to, and compromising the integrity of, the second flying leadconductive layer 356, which may not be resistant the etchant.

Each of the methods of manufacture described above can alternativelyinclude a step to add a ground plane such as the ground plane 470 shownin FIG. 14 of conductive material to the flexure. For example. In eachmethod, prior to the step of applying a dielectric material onto thespring metal layer, a layer of conductive material can be applieddirectly to the spring metal layer. Referring to FIGS. 28A-C, theprocess includes applying a mask resist material 496 using aphotolithography process of the type described above onto the areas of afirst major surface 421 and a second major surface 423 of spring metallayer 420 of flexure 410 where it is not desired to apply a ground plane470. After the resist material 496 is properly cured, the ground planelayer 470 is applied to the spring metal layer 420. After the process ofapplying the ground plane layer has been completed, the resist material496 is removed and subsequent steps are taken to add the remaininglayers of the conductive leads as described above in multiplealternative embodiments.

The invention offers a number of advantages. The use of metals that areeither non-corrosive or nearly non-corrosive provides for an improvedflexure that is more robust and less reliant on coatings to preventcorrosion. Noble or near noble metals such as gold and silver are morecorrosion resistant than other materials. Flying leads with a goldsurface can accept ultrasonic bonding for attachment of externalconductive leads such as a flex circuit to the flying leads. Further,the strengthened leads of the current invention are suitable for reworkwithout sustaining damage. Further still, by extending the flying leadsonto ends of the primary conductor portions in embodiments where theflying leads are applied in a secondary operation, the process yields amore robust conductive lead, as the chance of misregistration isminimized.

In addition, the processes of manufacturing the conductive assembliesonto the spring metal layer of the flexures described above provideimportant advantages and efficiencies, including improved yields,stronger flying leads, and greater flexibility in choosing materials forvarious portions of the conductive leads. For example, performing mostof the manufacturing steps before the step of removing the spring steellayer below the flying leads and other features, allows the addition ofmaterials onto a dimensionally stable material. This leads to superiorregistration as compared to processes performed after the stainlesssteel etch. Further, the steps of applying liquid materials (which arelater cured) to form the dielectric layer or cover layer onto acontinuous material results in more uniform coating. Further still, itis desirable to avoid handling the flexure after the etching process, asthe part becomes fragile and floppy. Reduced post etching steps leads toreduced damage due to handling and higher yields.

Although the present invention has been described with reference topreferred embodiments, those skilled in the art will recognize thatchanges can be made in form and detail without departing from the spiritand scope of the invention.

1. (canceled)
 2. An integrated lead flexure manufactured by an additiveprocess, including: a spring metal base layer; a dielectric insulatinglayer on portions of the spring metal base layer; and traces,comprising: first trace portions including a first structure of one ormore metal layers on the dielectric insulating layer over portions ofthe flexure backed by the spring metal base layer; and second traceportions including a second structure of one or more metal layersdifferent than the first structure over portions of the flexure freefrom the spring metal base layer.
 3. The integrated lead flexure ofclaim 2 wherein: the first trace portions include a layer from the groupconsisting of silver, copper or copper alloy; and the second traceportions include a layer of gold.
 4. The integrated lead flexure ofclaim 3 wherein the first trace portions include a layer of nickel. 5.The integrated lead flexure of claim 4 wherein the second trace portionsinclude a layer of nickel.
 6. The integrated lead flexure of claim 2 andfurther including strengthening structures at intersections of the firstand second trace portions.
 7. The integrated lead flexure of claim 2 andfurther including a covercoat layer over at least the first traceportions.
 8. The integrated lead flexure of claim 2 wherein the firsttrace portions include flying leads on a tail of the flexure.
 9. Anadditive process for manufacturing an integrated lead suspension flexureon a spring metal layer capable of being etched by a first etchingprocess, including: forming a patterned dielectric layer on a firstsurface of the spring metal layer, the patterned dielectric layer havingone or more gaps over aperture regions of the spring metal layer wherethe first surface of the spring metal layer is exposed; forming traces,comprising: forming first trace portions on the dielectric insulatinglayer; and forming second trace portions over the spring metal layer atthe aperture regions, wherein the second trace portions are formed frommetal resistant to the first etching process; and etching the apertureportions of the spring metal layer using the first etching process toexpose the second trace portions.
 10. The manufacturing process of claim9 wherein forming traces includes: forming a seed layer on the patterneddielectric layer and the first surface of the spring metal layer at theaperture region; and plating metal onto the seed layer.
 11. Themanufacturing process of claim 10 wherein forming traces includes:forming the first trace portions by plating a first structure of one ormore layers of metal onto the seed layer over the patterned dielectriclayer; and forming the second trace portions by plating a secondstructure of one or more layers of metal that is different than thefirst structure onto the seed layer over the spring metal layer at theaperture regions.
 12. The manufacturing process of claim 11 wherein: thespring metal layer is stainless steel; forming the second trace portionsincludes forming gold trace portions; and etching the aperture portionsincludes etching the aperture portions of the stainless steel springmetal layer with ferric chloride etchant.
 13. The manufacturing processof claim 9 wherein: the spring metal layer is stainless steel; andetching the aperture portions includes etching the aperture portions ofthe stainless steel spring metal layer with ferric chloride etchant. 14.The manufacturing process of claim 9 and further including forming apatterned first etching process resist layer over portions of a secondsurface of the spring metal layer opposite the first surface from thedielectric layer before etching the aperture portions of the springmetal layer.
 15. The manufacturing process of claim 14 and furtherincluding forming a patterned first etching process resist layer over atleast portions of the first trace portions and the first surface of thespring metal layer before etching the aperture portions of the springmetal layer.